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Application
For scenarios with special process requirements such as photovoltaic junction box, 3D structure and grooved structure pad, and flexible board.
Key Features
EXCELLENT DISPENSING PERFORMANCE
Products can be formulated with Type3/4/5 alloy powders, offer smooth and enduring dispensibility with needles of different sizes or materials.
SUPERIOR SOLDERABILITY
Full, bright, and well-penetrated solder joints, low voiding rate, and a low soldering defect rate.
RELIABLE ELECTRICAL PERFORMANCE
Minimal post-soldering residue, even spreading, not easy to absorb moisture, clean-free, high surface insulation resistance
HIGH STABILITY
ROL0 flux (J-STD-004B), with moderate activity, low residue and easy cleaning, and no corrosion to copper plates (Grade-L copper mirror test).
WIDE REFLOW PROCESS WINDOW
Achieving excellent welding results within a wide reflow soldering temperature zone.
Specifications
ITEM | TECHNICAL INDICATORS | TEST STANDARDS |
Alloy component | Sn63Pb37 | Section 3.2 of JSTD-005 |
Sn62.8/Pb36.8/Ag0.4 | ||
Sn62.9/Pb36.9/Ag0.2 | ||
Powder particle size | Type 3 25-45μm | IPC-TM-650 2.2.14.3 |
Type 4 20-38μm | ||
Type 5 15-25μm | ||
Viscosity (Pa.s) @25±0.2° C | 100-180(10rpm/min) | IPC-TM-650 2.4.34.1 |
Metal content (%) | 89.50±1.00 | IPC-TM-650 2.2.20 |
Flux content (%) | 10.50±1.00 | IPC-1M-650 2 2 20 |
Solder ball test | Solder ball free from segregation | IPC-TM-650 2.4.43 |
Wetting test | Free from wetting or de-wetting | IPC-TM-650 2.4.45 |
Collapse test | Comply with Section 3.6.2 | IPC-TM-650 2.4.35 |
Flux type | ROL0 | JSTD.004B |
Copper plate corrosion | Non corrosion | IPC-TM-650 2.6.15 |
Copper mirror corrosion test | Grade L | IPC-TM-650 2.3.32 |
Surface insulation resistance (Ω) | ≥1x108 | IPC-TM-650 2.6 3.3 |
Electromigration | Qualified | IPC-TM-650 2.6.14.1 |
