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Energy Storage Solder Paste

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Energy Storage Solder Paste

 
Product Mode: WTO-LF4000A-HR / WTO-LF9600-HR / WTO-LF1001F.
 
Tackling characteristic demands of the power storage industry such as high temperature, high humidity, high pressure, high power, vibration, and thermal shock, Vital has developed zero-halogen anti-dendrite high-reliability solder paste and high-energy fatigue-resistant and shock-resistant solder paste that meet the process requirements of this industry.
Product Description

Application

The products can be used for soldering various components such as BGA, CSP, QFN packages in scenarios like energy storage, automotive electronics, and communication base stations, as well as in other high-reliability and high-quality electronic appliances.


Key Features

LF4000A-HR

  • Excellent continuous printability

  • Excellent solderability, low voiding rate, and with good compatibility

  • Halogen free, little residue, and high surface insulation resistance


LF9600-HR

  • Superior continuous printing and welding reliability

  • High mechanical reliability in temperature cycling, thermal shock and drop tests

  • Halogen free, little residue, and high surface insulation resistance


WTO-LF1001F

  • Excellent thermal collapse resistance and outstanding performance of surface-mounted solder balls

  • Stable performance, excellent anti-interference performance and wide process window

  • High activity and excellent wettability of the substrate with different surface treatment processes


Specifications

ITEM

WTO-LF4000A-HR

WTO-LF9600-HR

WTO-LF1001F

TEST STANDARDS

Alloy component

Sn96.5Ag3Cu0.5

SnAg3.4Cu0.7S

Sn96.5Ag3.0Cu0.5

/

Powder particle size

Type 4 20-38um

Type4 20-38um

Type 3 25-45um

/

Type5 15-25um

Type5 15-25um

Type 4 20-38um

/

Viscosity (Pa.s)@25+0.2℃

170+30(10rpm/min)

170±30 (10rpm/min)

170+30(10rpm/min)

Malcom PCU 205

Metal content (%)

88.5±1.0

88.50±1.00

88.80±0.50

IPC-TM-650 2.2.20

Flux content (%)

11.5±1.0

11.50±1.00

11.20±0.50

IPC-TM-650 2.2.20

Solder ball test

Qualified

Qualified

Qualified

IPC-TM-650 2.4.43

Wetting test

Qualified

Qualified

Qualified

IPC-TM-650 2.4.45

Collapse test

Qualified

Qualified

Qualified

IPC-TM-650 2.4.35

Flux type

ROL0

ROL0

ROL1

IPC-J-STD-004B

Copper plate corrosion test

Non corrosion

Non corrosion

Non corrosion

IPC-TM-650 2.3.32

Copper mirror corrosion test

Grade L

Grade L

Grade L

IPC-TM-650 2.3.32

Electromigration

Qualified

Qualified

Qualified

IPC-TM-650 2.6.14.1

Surface insulation resistance (Ω)

≥1x108

≥1x108

≥1x108

IPC-TM-650 2.6.3.3

RoHS

Qualified

Qualified

Qualified

RoHS Directives


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