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Application
It is widely used in PV, military products, LED and other high-reli- ability, high-quality electronics.
Key Features
HIGH-SPEED PRINTING STABILITY
Under high-speed printing conditions of 500 ~ 700 mm/s, the paste printing is uniform and stable, and the printing life is over 12 hours.
HIGH YIELD RATE
It has excellent welding performance on silver-based and copper-based solar cells, free from solder balls, and can be compatible with the welding of solar cells with different coatings. The welding tensile force is greater than 3N, and the yield rate is 99.5%.
HIGH RELIABILITY
Grade-L copper etching/ SIR > 1010, with little residue and no dendrite migration.
It has passed the TC200/ HF10/ DH1000/UV aging tests and meets the IPC standards and reliability requirements of photovoltaic modules.
LOW UNIT CONSUMPTION
It can adapt to the stability and consistency performance for smaller pad and thinner steel mesh, and reduce the unit consumption of solder paste.
HEAD VERIFICATION, UNIVERSAL AND RELIABLE
The product has been applied in batches by multiple customers of AIKO, Tongwei and Jinko for more than one year. It has high universality, and its reliability and process compatibility have been well recognized by the market.
Specifications
ITEM | TECHNICAL INDICATORS | TEST STANDARDS |
Alloy component | Sn63Pb37 | Section3.2 J-STD-005 |
Sn62.8/Pb36.8/Ag0.4 | ||
Sn62.9/Pb36.9/Ag0.2 | ||
Sn62/Pb36/Ag2 | ||
Sn43/Pb43/Bi14 | ||
Powder particle size | Type 3 25-45μm | IPC-TM-650 2.2.14.3 |
Type 4 20-38μm | ||
Type 5 15-25μm | ||
Viscosity (Pa.s) @25±2℃ | 100-180 (10rpm/min) | IPC-TM-650 2.4.34.1 |
Metal content (%) | 89.00±1.00 | IPC-TM-650 2.2.20 |
Flux content (%) | 11.00±1.00 | IPC-TM-650 2.2.20 |
Solder ball test | Solder ball free from segregation | IPC-TM-650 2.4.43 |
Wetting test | Free from wetting or de-wetting | IPC-TM-650 2.4.45 |
Collapse test | Comply with Section 3.6.2 | IPC-TM-650 2.4.35 |
Flux type | ROL0 | J-STD-004B |
Copper plate corrosion | Non corrosion | IPC-TM-650 2.6.15 |
Copper mirror corrosion test | Grade L | IPC-TM-650 2.3.32 |
Surface insulation resistance (Ω) | ≥1×108 | IPC-TM-650 2.6.3.3 |
Electromigration | Qualified | IPC-TM-650 2.6.14.1 |
